Build to print rf/dc custom Thin-Film circiut manufacturer.
ATP offers build to print service for a wide range of materials and metallization schemes. ATP fabricates circuits on substrates using Alumina, Aluminum Nitride, Beryllium Oxide, Fused Silica/Quartz and Hi-K Dielectrics. Metallizations range from standard films to Aluminum, Chrome, Copper, Nickel, Gold, Palladium, Platinum, Titanium and Titanium Tungsten.
Circuit features can include fine pitch conductors, integrated resistors, vias, wrap arounds, double sided patterning, polyimide supported bridges, hollow plated and solid filled vias.
Keywords: Thin-Film, Circuits, metallization, materials